Giant pop-ins in nanoindented silicon and germanium caused by lateral cracking

Abstract

Giant “pop-in” displacements are observed in crystalline silicon and germanium during high-load nanoindentation with a spherical diamond tip. These events are consistent with material removal triggered by lateral cracking during loading, which poses a hazard to microelectromechanical systems (MEMS) operation. We examine the scaling of the pop-in displacements as a function of peak indentation load and demonstrate a correlation with the depth of the plastic contact zone. We argue that giant pop-ins may occur in a broad range of highly brittle materials.