Wafer-level flame-spray-pyrolysis deposition of gas-sensitive layers on microsensors

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Kuhne, S
Graf, M
Tricoli, Antonio
Mayer, F
Pratsinis, S.E
Hierlemann, A

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IOP Publishing

Abstract

This paper presents a CMOS-compatible wafer-level fabrication process for monolithic CMOS/MEMS sensor systems coated with sensitive layers directly deposited by means of flame spray pyrolysis (FSP). Microhotplate (νHP)-based devices, featuring an FSP dir

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Journal of Micromechanics and Microengineering

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Restricted until

2037-12-31