Wafer-level flame-spray-pyrolysis deposition of gas-sensitive layers on microsensors
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Kuhne, S
Graf, M
Tricoli, Antonio
Mayer, F
Pratsinis, S.E
Hierlemann, A
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IOP Publishing
Abstract
This paper presents a CMOS-compatible wafer-level fabrication process for monolithic CMOS/MEMS sensor systems coated with sensitive layers directly deposited by means of flame spray pyrolysis (FSP). Microhotplate (νHP)-based devices, featuring an FSP dir
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Journal of Micromechanics and Microengineering
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2037-12-31
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